Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2019
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Application #:
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15329573
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Filing Dt:
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01/26/2017
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Publication #:
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Pub Dt:
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07/26/2018
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Inventors:
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Michiya Higuchi, Tokuzan Miyake, Yoshio Sakai, Nobuhito Hamada
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Title:
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LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 58, IJIRI, ISEDA-CHO |
| UJI-SHI, KYOTO, JAPAN 611-0043 |
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| LEE CHENG |
| 1133 13TH STREET N.W. STE C2 |
| WASHINGTON, DC 20005 |
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