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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10242925
Issue Dt:
03/26/2019
Application #:
15527944
Filing Dt:
07/03/2017
Publication #:
20180312640
Pub Dt:
11/01/2018
Inventors:
Philippe Banet, Odile Fichet, Thomas Fouet, Linda Chikh
Title:
ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS
Assignment: 1
Reel/Frame:
042852/0576Recorded: 06/28/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FOUET, THOMAS
Exec Dt:
06/12/2017
BANET, PHILIPPE
Exec Dt:
06/09/2017
CHIKH, LINDA
Exec Dt:
06/09/2017
FICHET, ODILE
Exec Dt:
06/09/2017
Assignee:
INSTITUT VEDECOM
77 RUE DES CHANTIERS
VERSAILLES, FRANCE F-78000
Correspondent:
JONATHAN P SOIFER
12412 POWERSCOURT DR.
SUITE 200
ST. LOUIS, MO 63131
Assignment: 2
Reel/Frame:
043085/0441Recorded: 07/05/2017Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO ADD 2ND ASSIGNEE'S DATA PREVIOUSLY RECORDED ON REEL 042852 FRAME 0576. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
FOUET, THOMAS
Exec Dt:
06/12/2017
BANET, PHILIPPE
Exec Dt:
06/09/2017
CHIKH, LINDA
Exec Dt:
06/09/2017
FICHET, ODILE
Exec Dt:
06/09/2017
Assignees:
INSTITUT VEDECOM
77 RUE DES CHANTIERS
VERSAILLES, FRANCE F-78000
UNIVERSITÉ DE CERGY PONTOISE
33 BOULEVARD DU PORT
CERGY-PONTOISE, FRANCE 95011
Correspondent:
POLSTER, LIEDER
12412 POWERSCOURT DRIVE
SUITE 200
ST. LOUIS, MO 63131

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