Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/02/2019
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Application #:
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15310684
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Filing Dt:
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11/11/2016
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Publication #:
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Pub Dt:
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03/23/2017
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Inventors:
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Sunil Wickramanayaka, Ling Xie, Jerry Jie Li Aw
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Title:
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A METHOD FOR BONDING A CHIP TO A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 FUSIONOPOLIS WAY |
| #20-10 CONNEXIS |
| SINGAPORE, SINGAPORE 138632 |
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| CHOATE HALL & STEWART LLP-PATENT DOCKET |
| TWO INTERNATIONAL PLACE |
| BOSTON, MA 02110 |
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