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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/23/2019
Application #:
14971072
Filing Dt:
12/16/2015
Publication #:
Pub Dt:
06/30/2016
Inventors:
Motohiro Onitsuka, Yoko Kurasawa, Toshihisa Kugi, Hiroshi Kawanago, Kaichi Tsuruta
Title:
Flux for Resin Flux Cored Solder, Flux for Flux Coated Solder, Resin Flux Cored Solder and Flux Coated Solder
Assignment: 1
Reel/Frame:
037306/0069Recorded: 12/16/2015Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/09/2015
Exec Dt:
12/09/2015
Exec Dt:
12/09/2015
Exec Dt:
12/09/2015
Exec Dt:
12/09/2015
Assignee:
23, SENJU-HASHIDO-CHO, ADACHI-KU
TOKYO, JAPAN 120-8555
Correspondent:
THE WEBB LAW FIRM, P.C.
ONE GATEWAY CENTER
420 FT. DUQUESNE BLVD, SUITE 1200
PITTSBURGH, PA 15222

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