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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/23/2019
Application #:
15837042
Filing Dt:
12/11/2017
Publication #:
Pub Dt:
04/04/2019
Inventors:
Shih-Ping Hsu, Che-Wei Hsu
Title:
Sensor Package and Method of Manufacturing the Same
Assignment: 1
Reel/Frame:
044348/0526Recorded: 12/11/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/06/2017
Exec Dt:
11/06/2017
Assignee:
P.O. BOX 31119, GRAND PAVILION
HIBISCUS WAY, 802 WEST BAY ROAD
GRAND CAYMAN, CAYMAN ISLANDS KY1-1205
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339
Assignment: 2
Reel/Frame:
053021/0059Recorded: 06/24/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/22/2020
Assignee:
NO.458-17, XINXING RD., HUKOU TOWNSHIP
HSINCHU COUNTY, TAIWAN 30353
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE
SUITE 550
ATLANTA, GA 30339

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