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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2019
Application #:
15814189
Filing Dt:
11/15/2017
Publication #:
Pub Dt:
06/21/2018
Inventors:
Meng-Han LIN, Chia-Lin LIANG, Chih-Ren HSIEH
Title:
METHOD FOR TESTING BRIDGING IN ADJACENT SEMICONDUCTOR DEVICES AND TEST STRUCTURE
Assignment: 1
Reel/Frame:
044431/0868Recorded: 12/19/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/06/2017
Exec Dt:
11/06/2017
Exec Dt:
11/06/2017
Assignee:
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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