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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2019
Application #:
15596392
Filing Dt:
05/16/2017
Publication #:
Pub Dt:
09/07/2017
Inventors:
Yeong-Jyh Lin, Hsiao-Chung Liang, Chien Ling Hwang, Bor-Ping Jang
Title:
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACKAGE STRUCTURE, AND A METHOD OF MAKING
Assignment: 1
Reel/Frame:
042393/0084Recorded: 05/16/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2013
Exec Dt:
08/30/2013
Exec Dt:
08/30/2013
Exec Dt:
08/30/2013
Assignee:
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
ESCHWEILER & POTASHNIK, LLC
ROSETTA CENTER
629 EUCLID AVE., SUITE 1000
CLEVELAND, OH 44114

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