Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/07/2019
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Application #:
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15334606
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Filing Dt:
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10/26/2016
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Publication #:
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Pub Dt:
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04/26/2018
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Inventors:
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Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal
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Title:
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Bonding of Laminates with Electrical Interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| INVENSAS CORPORATION |
| 3025 ORCHARD PARKWAY |
| ATTN: PATENT DEPT. |
| SAN JOSE, CA 95134 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| STEWART WALSH |
| 1025 VERMONT AVE NW, SUITE 1130 |
| COGENCY GLOBAL INC. |
| WASHINGTON, DC 20005 |
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