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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/14/2019
Application #:
16024054
Filing Dt:
06/29/2018
Inventors:
Dennis Ciplickas, Jeremy Cheng, Indranil De, Stephen Lam, Tomasz Brozek, Simone Comensoli et al
Title:
Method For Processing A Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative Of At Least One Tip-To-Tip Short Or Leakage, At Least One Via-Chamfer Short Or Leakage, And At Least One Corner Short Or Leakage, Where Such Measurements Are Obtained From Cells With Respective Tip-To-Tip Short, Via-Chamfer Short, And Corner Short Test Areas, Using A Charged Particle-Beam Inspector With Beam Deflection To Account For Motion Of The Stage
Assignment: 1
Reel/Frame:
046267/0422Recorded: 07/05/2018Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/21/2016
Exec Dt:
04/15/2016
Exec Dt:
04/20/2016
Exec Dt:
05/06/2016
Exec Dt:
04/13/2016
Exec Dt:
04/12/2016
Exec Dt:
04/28/2016
Exec Dt:
04/26/2016
Exec Dt:
04/13/2016
Exec Dt:
04/13/2016
Exec Dt:
04/12/2016
Exec Dt:
04/18/2016
Exec Dt:
04/14/2016
Exec Dt:
04/15/2016
Exec Dt:
04/28/2016
Exec Dt:
04/25/2016
Exec Dt:
04/18/2016
Exec Dt:
04/21/2016
Exec Dt:
04/26/2016
Exec Dt:
04/13/2016
Exec Dt:
04/28/2016
Exec Dt:
04/13/2016
Exec Dt:
04/13/2016
Exec Dt:
04/12/2016
Exec Dt:
04/21/2016
Exec Dt:
04/13/2016
Assignee:
333 W. SAN CARLOS ST.
STE 1000
SAN JOSE, CALIFORNIA 95110
Correspondent:
DAVID GARROD, PH.D., ESQ.
711 IVY STREET
PITTSBURGH, PA 15232

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