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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/14/2019
Application #:
15682354
Filing Dt:
08/21/2017
Publication #:
Pub Dt:
02/21/2019
Inventors:
Thomas Lee Schick, Robert Matousek, Sunil Anuprasad Patel
Title:
COMPACT PRINTED CIRCUIT BOARD ASSEMBLY WITH INSULATING ENDCAP VIA
Assignment: 1
Reel/Frame:
043348/0609Recorded: 08/21/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/16/2017
Exec Dt:
08/16/2017
Exec Dt:
08/16/2017
Assignee:
10200 SOUTH DE ANZA BLVD.
CUPERTINO, CALIFORNIA 95014
Correspondent:
HOLZER PATEL DRENNAN
216 16TH STREET
SUITE 1350
DENVER, CO 80202
Assignment: 2
Reel/Frame:
067489/0509Recorded: 05/22/2024Pages: 35
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/23/2024
Exec Dt:
04/23/2024
Assignee:
1 YISHUN AVENUE 7
SINGAPORE, SINGAPORE 768923
Correspondent:
LU YIN
8210 SOUTHPARK TERRACE
LITTLETON, CO 80112

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