Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2019
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Application #:
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15984458
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Filing Dt:
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05/21/2018
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Publication #:
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Pub Dt:
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11/29/2018
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Inventors:
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Yoshikazu Hirano, KINUKO MISHIRO, Toru Okada
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Title:
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SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEVICE, METHOD FOR SOLDERING ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| FUJITSU PATENT CENTER |
| 2318 MILL ROAD |
| ALEXANDRIA, VA 22314 |
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