Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15315840
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Filing Dt:
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12/02/2016
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Publication #:
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Pub Dt:
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04/13/2017
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Inventors:
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Kazuo Arita, Tomohiro Shimono
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Title:
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CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 35-58, SAKASHITA 3-CHOME, ITABASHI-KU |
| TOKYO, JAPAN 174-8520 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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