Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15147807
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Filing Dt:
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05/05/2016
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Publication #:
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Pub Dt:
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11/09/2017
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Inventors:
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Liang Wang, Belgacem Haba, Bongsub Lee, Sangil Lee
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Title:
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Nanoscale Interconnect Array for Stacked Dies
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| INVENSAS CORPORATION |
| 3025 ORCHARD PARKWAY |
| SAN JOSE, CA 95134 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| STEWART WALSH |
| 1025 VERMONT AVE NW, SUITE 1130 |
| COGENCY GLOBAL INC. |
| WASHINGTON, DC 20005 |
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Assignment:
3
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CERTIFICATE OF CONVERSION & CHANGE OF NAME
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| HALEY GUILIANO LLP |
| 111 NORTH MARKET ST., SUITE 900 |
| SAN JOSE, CA 95113 |
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