Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/11/2019
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Application #:
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15697751
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Filing Dt:
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09/07/2017
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Publication #:
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Pub Dt:
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03/15/2018
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Inventors:
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Katsumasa YAMAGUCHI, Kensaku NARUSHIMA
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Title:
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Method of Filling Recesses in Substrate with Tungsten
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKSAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| NATH, GOLDBERG & MEYER |
| 112 S WEST STREET |
| 35428U_JLM_HJ |
| ALEXANDRIA, VA 22314 |
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