Patent Assignment Abstract of Title
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Total Assignments:
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Patent #:
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Issue Dt:
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06/11/2019
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Application #:
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15566385
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Filing Dt:
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10/13/2017
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Publication #:
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Pub Dt:
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03/29/2018
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Inventors:
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Yoshiyuki Nagatomo, Nobuyuki Terasaki
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Title:
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BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING HEAT SINK
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN 1008117 |
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LOCKE LORD LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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