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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
06/25/2019
Application #:
15610805
Filing Dt:
06/01/2017
Publication #:
Pub Dt:
12/06/2018
Inventors:
Xikun Zhang, Yang Liu, Bill Agar
Title:
Semiconductor Package with Integrated Harmonic Termination Feature
Assignment: 1
Reel/Frame:
042561/0647Recorded: 06/01/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2017
Exec Dt:
05/02/2017
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
042561/0993Recorded: 06/01/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/03/2017
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 3
Reel/Frame:
043484/0213Recorded: 09/05/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/22/2017
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
IRIS DRUCKENBROD
AM CAMPEON 1-12
PATENT DEPARTMENT MUC/11.2.348
NEUBIBERG, 85579 GERMANY

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