Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/2019
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Application #:
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16077968
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Filing Dt:
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08/14/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventor:
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Christian VAL
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Title:
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METHOD OF MINIATURIZED CHIP ON CHIP INTERCONNECTION OF A 3D ELECTRONIC MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 408 RUE HÉLÈNE BOUCHER |
| BUC CEDEX, FRANCE 78530 |
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| BAKER & HOSTETLER LLP |
| WASHINGTON SQUARE, SUITE 1100 |
| 1050 CONNECTICUT AVENUE, N.W. |
| WASHINGTON, DC 20036 |
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