Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/09/2019
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Application #:
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15230670
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Filing Dt:
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08/08/2016
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Publication #:
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Pub Dt:
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03/02/2017
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Inventors:
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Tao WANG, Zhenqing ZHAO, Kai LU, Zeng LI, Jianhong ZENG
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Title:
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POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACTURING POWER CHIP UNIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F&7F&8F, BUILDING 1, NO.1675 HUADONG ROAD, PUDONG |
| SHANGHAI, CHINA 201209 |
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| YUNLING REN |
| C/O EATON & VAN WINKLE |
| 3 PARK AVENUE |
| NEW YORK, NY 10016 |
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