Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/09/2019
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Application #:
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15209930
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Filing Dt:
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07/14/2016
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Publication #:
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Pub Dt:
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01/19/2017
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Inventors:
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Nobuaki Miyamoto, Michiya Kohiki
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Title:
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Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008164 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE #5 |
| WESTBOROUGH, MA 01581 |
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Assignment:
2
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| 10-4, TORANOMON 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 100-8164 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE ST |
| ST HELIER, JE1 1BL JERSEY |
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