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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10354874
Issue Dt:
07/16/2019
Application #:
15812750
Filing Dt:
11/14/2017
Publication #:
20190148145
Pub Dt:
05/16/2019
Inventors:
Shih-Chun Huang, Chin-Hsiang Lin, Chien-Wen Lai, Ru-Gun Liu, Wei-Liang Lin, Ya Hui Chang et al
Title:
DIRECTIONAL PROCESSING TO REMOVE A LAYER OR A MATERIAL FORMED OVER A SUBSTRATE
Assignment: 1
Reel/Frame:
045394/0562Recorded: 03/30/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, SHIH-CHUN
Exec Dt:
03/08/2018
LIN, CHIN-HSIANG
Exec Dt:
03/15/2018
WEN, LAI CHIEN
Exec Dt:
03/12/2018
LIU, RU-GUN
Exec Dt:
03/13/2018
LIN, WEI-LIANG
Exec Dt:
03/14/2018
CHANG, YA HUI
Exec Dt:
03/14/2018
YEN, YUNG-SUNG
Exec Dt:
03/08/2018
SHEN, YU-TIEN
Exec Dt:
03/08/2018
YEH, YA-WEN
Exec Dt:
03/08/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046
Assignment: 2
Reel/Frame:
049403/0244Recorded: 06/06/2019Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PREVIOUSLY RECORDED AT REEL: 045394 FRAME: 0562. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
HUANG, SHIH-CHUN
Exec Dt:
05/27/2019
LIN, CHIN-HSIANG
Exec Dt:
05/27/2019
LAI, CHIEN-WEN
Exec Dt:
05/27/2019
LIU, RU-GUN
Exec Dt:
05/27/2019
LIN, WEI-LIANG
Exec Dt:
05/27/2019
CHANG, YA HUI
Exec Dt:
05/27/2019
YEN, YUNG-SUNG
Exec Dt:
05/27/2019
SHEN, YU-TIEN
Exec Dt:
05/27/2019
YEH, YA-WEN
Exec Dt:
05/27/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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