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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/30/2019
Application #:
16101509
Filing Dt:
08/12/2018
Publication #:
Pub Dt:
12/06/2018
Inventors:
Mingzhu WANG, Bojie Zhao, Takehiko Tanaka, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
Title:
Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof
Assignment: 1
Reel/Frame:
046944/0741Recorded: 08/27/2018Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/13/2018
Exec Dt:
08/01/2018
Exec Dt:
08/02/2018
Exec Dt:
08/02/2018
Exec Dt:
08/09/2018
Exec Dt:
08/02/2018
Exec Dt:
08/02/2018
Assignee:
66-68, SHUNYU ROAD, YUYAO,
NINGBO, ZHEJIANG, CHINA 315400
Correspondent:
DAVID AND RAYMOND PATENT FIRM
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754

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