Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15978193
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Filing Dt:
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05/14/2018
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Inventor:
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Wen-Hua LIEN
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Title:
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METHOD OF FORMING BARRIER LAYER OVER VIA, AND VIA STRUCTURE FORMED THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.98, NANLIN RD., TAISHAN DIST. |
| NEW TAIPEI CITY, TAIWAN 243 |
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| CKC & PARTNERS CO., LTD. |
| ROOM 1901, 19/F, LEE GARDEN ONE |
| 33 HYSAN AVENUE, CAUSEWAY BAY |
| HONG KONG, HONG KONG |
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