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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/03/2019
Application #:
15550289
Filing Dt:
08/10/2017
Publication #:
Pub Dt:
02/01/2018
Inventors:
Yousuke EBIHARA, Osamu KOYAMA
Title:
THERMAL EXPANDABILITY ADJUSTER, USE AS THERMAL EXPANDABILITY ADJUSTER, THERMOSET RESIN COMPOSITION, INSULATING MATERIAL, SEALING MATERIAL AND CONDUCTIVE PASTE EACH CONTAINING THERMOSET RESIN COMPOSITION, CURED PRODUCTS, PREPREG AND MEMBER OBTAINED BY CURING THERMOSET RESIN COMPOSITION OF PREPREG, METHOD OF ADJUSTING THERMAL EXPANSION RATE, AND MEMBER MANUFACTURED USING METHOD OF ADJUSTING
Assignment: 1
Reel/Frame:
043265/0779Recorded: 08/11/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/27/2017
Exec Dt:
07/27/2017
Assignee:
2, NISHI 1-CHOME, KITA SANJO, CHUO-KU, SAPPORO-SHI
HOKKAIDO, JAPAN 0600003
Correspondent:
HAMRE, SCHUMANN, MUELLER & LARSON, P.C.
45 SOUTH SEVENTH STREET
SUITE 2700
MINNEAPOLIS, MN 55402-1683

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