Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
09/03/2019
|
Application #:
|
15550289
|
Filing Dt:
|
08/10/2017
|
Publication #:
|
|
Pub Dt:
|
02/01/2018
| | | | |
Inventors:
|
Yousuke EBIHARA, Osamu KOYAMA
|
Title:
|
THERMAL EXPANDABILITY ADJUSTER, USE AS THERMAL EXPANDABILITY ADJUSTER, THERMOSET RESIN COMPOSITION, INSULATING MATERIAL, SEALING MATERIAL AND CONDUCTIVE PASTE EACH CONTAINING THERMOSET RESIN COMPOSITION, CURED PRODUCTS, PREPREG AND MEMBER OBTAINED BY CURING THERMOSET RESIN COMPOSITION OF PREPREG, METHOD OF ADJUSTING THERMAL EXPANSION RATE, AND MEMBER MANUFACTURED USING METHOD OF ADJUSTING
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
2, NISHI 1-CHOME, KITA SANJO, CHUO-KU, SAPPORO-SHI |
HOKKAIDO, JAPAN 0600003 |
|
|
|
HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
45 SOUTH SEVENTH STREET |
SUITE 2700 |
MINNEAPOLIS, MN 55402-1683 |
|
|
Search Results as of:
03/29/2024 04:44 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|