Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/03/2019
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Application #:
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15726409
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Filing Dt:
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10/06/2017
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Publication #:
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Pub Dt:
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02/01/2018
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Inventors:
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Yongbo YANG, Antonio Jr. Bambalan DIMAANO, Chun Hong WO
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Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 SERANGOON NORTH AVENUE 5 |
SINGAPORE, SINGAPORE 554916 |
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HORIZON IP PTE. LTD. |
7500A BEACH ROAD |
#04-306/308 THE PLAZA |
SINGAPORE, 199591 SINGAPORE |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569506 |
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HORIZON IP PTE. LTD. |
7500A BEACH ROAD, #04-306/308 |
SINGAPORE, 199591 SINGAPORE |
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