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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/08/2019
Application #:
15313670
Filing Dt:
11/23/2016
Publication #:
Pub Dt:
07/27/2017
Inventors:
Shigemasa NAKASUGI, Takafumi KINUTA, Go NOYA
Title:
VOID FORMING COMPOSITION, SEMICONDUCTOR DEVICE PROVIDED WITH VOIDS FORMED USING COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING COMPOSITION
Assignment: 1
Reel/Frame:
040409/0427Recorded: 11/23/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/31/2016
Exec Dt:
10/31/2016
Exec Dt:
10/31/2016
Assignee:
46 PLACE GUILIAUME II L-1648
GRAND DUCHY OF LUXEMBOURG, LUXEMBOURG
Correspondent:
ASHLEY I. PEZZNER
222 DELAWARE AVE
WILMINGTON, DE 19801

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