Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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16248078
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Filing Dt:
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01/15/2019
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Publication #:
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Pub Dt:
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05/16/2019
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Inventors:
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Gu Won Ji, Heung Kil Park, Se Hun Park
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Title:
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Multilayer Electronic Component and Board Having the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20004-2541 |
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