Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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15973500
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Filing Dt:
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05/07/2018
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Publication #:
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Pub Dt:
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06/20/2019
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Inventor:
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CHI-CHENG HUNG
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Title:
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DUAL-CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO.17, GONGYE E. 2ND RD., |
| EAST DIST., |
| HSINCHU CITY, TAIWAN 300 |
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| LANWAY IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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