Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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15631282
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Filing Dt:
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06/23/2017
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Publication #:
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Pub Dt:
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10/12/2017
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Inventors:
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Hajime INOUE, Tadashi Takano
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Title:
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SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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