Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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15989564
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Filing Dt:
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05/25/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Inventors:
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Chang Hwa PARK, Ichiro OGURA
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Title:
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SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HOSANG LEE |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MORGAN LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20004 |
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