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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/22/2019
Application #:
16106037
Filing Dt:
08/21/2018
Publication #:
Pub Dt:
06/13/2019
Inventors:
Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
Title:
VCSEL STRUCTURE WITH EMBEDDED HEAT SINK
Assignment: 1
Reel/Frame:
046655/0377Recorded: 08/22/2018Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2016
Exec Dt:
01/19/2016
Exec Dt:
01/17/2016
Assignee:
ONE APPLE PARK WAY
CUPERTINO, CALIFORNIA 95014
Correspondent:
D. KLIGLER I.P. SERVICES LTD.
P.O. BOX 57651
TEL AVIV, 61576 ISRAEL

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