Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15698650
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Filing Dt:
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09/08/2017
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Publication #:
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Pub Dt:
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03/14/2019
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Inventors:
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Takeshi NAKANO, Tsukasa KATSUYAMA, Masaya ARAI, Atsushi HORI, Yurika MUNEKAWA
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Title:
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LEAD-FREE SOLDER ALLOY, ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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| MORI & WARD, LLP |
| 225 REINEKERS LANE |
| SUITE 690 |
| ALEXANDRIA, VA 22314 |
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