Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15198292
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Filing Dt:
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06/30/2016
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Publication #:
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Pub Dt:
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01/04/2018
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Inventors:
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Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel, Thomas M. Shaw
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Title:
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Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| MICHAEL J. CHANG |
| 84 SUMMIT AVENUE |
| MICHAEL J. CHANG, LLC |
| MILFORD, CT 06460 |
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