Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15788435
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Filing Dt:
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10/19/2017
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Publication #:
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Pub Dt:
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04/26/2018
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Inventors:
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Hidekazu Tanisawa, Shinji Sato, Fumiki Kato, Hiroshi Sato, Kenichi Koui, Hiroki Takahashi et al
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Title:
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BONDING PAD STRUCTURE OF A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 TANABESHINDEN, KAWASAKI-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530 |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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