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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10467021
Issue Dt:
11/05/2019
Application #:
15264441
Filing Dt:
09/13/2016
Publication #:
20170052801
Pub Dt:
02/23/2017
Inventors:
Tung M. NGUYEN, Syed Najaf RIZVI, David NGUYEN, Adam DROBOT, Eric Anderson
Title:
HIGH DENSITY MULTI NODE COMPUTER WITH IMPROVED EFFICIENCY, THERMAL CONTROL, AND COMPUTE PERFORMANCE
Assignment: 1
Reel/Frame:
040269/0887Recorded: 11/09/2016Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NGUYEN, TUNG M
Exec Dt:
09/29/2016
RIZVI, SYED NAJAF ALI
Exec Dt:
09/30/2016
NGUYEN, DAVID
Exec Dt:
10/01/2016
DROBOT, ADAM
Exec Dt:
09/28/2016
ANDERSON, ERIC
Exec Dt:
09/28/2016
Assignee:
ADVANCED GREEN COMPUTING MACHINES-IP
UNIT 801, 8TH FLOOR, PACIFIC HOUSE
20 QUEEN'S ROAD CENTRAL
HONG KONG, CHINA
Correspondent:
MURABITO, HAO & BARNES LLP
TWO NORTH MARKET STREET
THIRD FLOOR
SAN JOSE, CA 95113
Assignment: 2
Reel/Frame:
065822/0101Recorded: 12/10/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
ADVANCED GREEN COMPUTING MACHINES-IP, LIMITED
Exec Dt:
11/14/2023
Assignee:
TMNCO INC.
340 E MIDDLEFIELD ROAD
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
IDEA INTELLECTUAL LIMITED
10/F-1, NO. 70-1, SECTION 1, CHENGDE ROAD
DATONG DISTRICT
TAIPEI, 103622 TAIWAN

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