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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/26/2019
Application #:
15721201
Filing Dt:
09/29/2017
Publication #:
Pub Dt:
01/25/2018
Inventors:
Bo-Tsung TSAI, Chun-Hao CHOU, Tsung-Han TSAI, Kuo-Cheng LEE, Yung-Lung HSU, Yun-Wei CHENG
Title:
CIS STRUCTURE WITH COMPLEMENTARY METAL GRID AND DEEP TRENCH ISOLATION AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
043759/0652Recorded: 10/02/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/22/2015
Exec Dt:
10/22/2015
Exec Dt:
10/22/2015
Exec Dt:
10/22/2015
Exec Dt:
10/22/2015
Exec Dt:
10/20/2015
Assignee:
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DR. SUITE 300
PARK CITY, UT 84098

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