Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/03/2019
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Application #:
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15483570
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Filing Dt:
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04/10/2017
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Publication #:
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Pub Dt:
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12/28/2017
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Inventors:
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Shu-Hsien Chung, Chung-Hsien Lee, Jhih-Hsien Wu, Ming-Haw Wang
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Title:
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PACKING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F., NO. 88, SEC. 1, XINTAI 5TH RD., XIZHI DIST. |
NEW TAIPEI CITY, TAIWAN 221 |
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J.C. PATENTS |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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