Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/10/2019
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Application #:
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15780543
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Filing Dt:
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05/31/2018
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Publication #:
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Pub Dt:
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12/20/2018
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Inventors:
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Ken TACHIBANA, Hikaru NOMURA, Yuki IIJIMA, Shunsaku YOSHIKAWA, Naoko IZUMITA et al
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Title:
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SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| MITSUHIRO HARAGUCHI, LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 10601-1526 |
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