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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/17/2019
Application #:
14057296
Filing Dt:
10/18/2013
Publication #:
Pub Dt:
02/20/2014
Inventors:
Hiroshi Horikawa, Masahiko Shioda
Title:
ALUMINUM ALLOY MATERIAL FOR USE IN THERMAL CONDUCTION APPLICATION
Assignment: 1
Reel/Frame:
050718/0712Recorded: 10/15/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/06/2009
Exec Dt:
08/06/2009
Assignee:
2-20, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 140-8628
Correspondent:
PEARNE & GORDON LLP
1801 EAST 9TH STREET
SUITE 1200
CLEVELAND, OH 44114-3108

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