Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/17/2019
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Application #:
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15327104
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Filing Dt:
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01/18/2017
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Publication #:
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Pub Dt:
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06/22/2017
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Inventors:
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Hideki Matsuda, Toshiya Iwai, Atsushi Kawamoto, Kenji Muraoka, Junichi Ishii et al
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Title:
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COMPOSITION FOR BONDED MAGNETS, BONDED MAGNET AND INTEGRALLY MOLDED COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 1058716 |
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| 430, MATSUHIDAI |
| MATSUDO-SHI, CHIBA, JAPAN 2702280 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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