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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/17/2019
Application #:
15717940
Filing Dt:
09/28/2017
Publication #:
Pub Dt:
03/28/2019
Inventors:
Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chao-Wen Shih, Nan-Chin Chuang
Title:
SEMICONDUCTOR PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
045791/0298Recorded: 05/13/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2017
Exec Dt:
11/10/2017
Exec Dt:
11/10/2017
Exec Dt:
11/10/2017
Exec Dt:
01/07/2018
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondent:
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI CITY, 10099 TAIWAN

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