Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/17/2019
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Application #:
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15675214
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Filing Dt:
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08/11/2017
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Publication #:
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Pub Dt:
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02/14/2019
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Inventors:
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Milind S. Bhagavat, Lei Fu, Ivor Barber, Chia-Ken Leong, Rahul Agarwal
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Title:
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MOLDED CHIP COMBINATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE, PO BOX 3453 |
| KEVIN A. O'NEIL |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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| TIMOTHY M. HONEYCUTT |
| 37713 PARKWAY OAKS LN. |
| MAGNOLIA, TX 77355 |
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