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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/17/2019
Application #:
16352108
Filing Dt:
03/13/2019
Publication #:
Pub Dt:
07/11/2019
Inventors:
Chun-Yuan Chen, Dun-Nian Yaung, Jhy-Jyi Sze, Ching-Chun Wang, Hsiao-Hui Tseng et al
Title:
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
Assignment: 1
Reel/Frame:
048586/0442Recorded: 03/13/2019Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/30/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/30/2015
Assignee:
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
ESCHWEILER & POTASHNIK, LLC
ROSETTA CENTER
629 EUCLID AVE., SUITE 1000
CLEVELAND, OH 44114

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