Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/24/2019
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Application #:
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15859097
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Filing Dt:
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12/29/2017
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Publication #:
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Pub Dt:
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05/03/2018
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Inventors:
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Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu
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Title:
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Methods of Forming Package-on-Package Structures
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE NAME OF FIFTH INVENTOR PREVIOUSLY RECORDED AT REEL: 033425 FRAME: 0009. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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