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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10516029
Issue Dt:
12/24/2019
Application #:
16437137
Filing Dt:
06/11/2019
Publication #:
20190296121
Pub Dt:
09/26/2019
Inventors:
Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei, Yi-Sheng Chen et al
Title:
DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
049429/0117Recorded: 06/11/2019Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, YI-HUAN
Exec Dt:
04/20/2018
CHOU, CHIEN-CHIH
Exec Dt:
04/20/2018
LIN, TA-WEI
Exec Dt:
04/20/2018
FAN, FU-JIER
Exec Dt:
04/20/2018
THEI, KONG-BENG
Exec Dt:
04/20/2018
CHEN, YI-SHENG
Exec Dt:
04/20/2018
LIU, SZU-HSIEN
Exec Dt:
04/20/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
ESCHWEILER & POTASHNIK, LLC
629 EUCLID AVE.
SUITE 1000
CLEVELAND, OH 44114

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