Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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16238786
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Filing Dt:
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01/03/2019
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Publication #:
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Pub Dt:
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05/23/2019
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Inventors:
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Charles G. WOYCHIK, Hong Shen, Liang WANG, Cyprian Emeka UZOH, Arkalgud R. SITARAM et al
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Title:
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MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSIONS OF CONDUCTIVE VIAS PROTRUDING FROM THROUGH-HOLES PASSING THROUGH SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE, SUITE 700 |
| DALLAS, TX 75219 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| STEWART WALSH |
| 1025 VERMONT AVE NW, SUITE 1130 |
| COGENCY GLOBAL INC. |
| WASHINGTON, DC 20005 |
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