Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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16194890
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Filing Dt:
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11/19/2018
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Inventors:
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Kuo-Hsin HUANG, Chung-Yu CHOU, Tzeng-Guang TSAI, Yung-Hsiang CHAO
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Title:
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FAN-OUT WAFER LEVEL LIGHT-EMITTING DIODE PACKAGE METHOD AND STRUCTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.2, KEDONG 1ST ROAD |
| CHUNAN TOWN, MIAOLI COUNTY |
| HSINCHU SCIENCE PARK, TAIWAN 35053 |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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