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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/31/2019
Application #:
16194890
Filing Dt:
11/19/2018
Inventors:
Kuo-Hsin HUANG, Chung-Yu CHOU, Tzeng-Guang TSAI, Yung-Hsiang CHAO
Title:
FAN-OUT WAFER LEVEL LIGHT-EMITTING DIODE PACKAGE METHOD AND STRUCTURE THEREOF
Assignment: 1
Reel/Frame:
047543/0805Recorded: 11/19/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/24/2018
Exec Dt:
10/24/2018
Exec Dt:
10/24/2018
Exec Dt:
10/24/2018
Assignee:
NO.2, KEDONG 1ST ROAD
CHUNAN TOWN, MIAOLI COUNTY
HSINCHU SCIENCE PARK, TAIWAN 35053
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, P.C.
4000 LEGATO ROAD
SUITE 310
FAIRFAX, VA 22033

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