Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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16425976
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Filing Dt:
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05/30/2019
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Publication #:
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Pub Dt:
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09/12/2019
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Inventor:
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Haijun WANG
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Title:
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LED PACKAGING MATERIAL AND MANUFACTURING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 9-2, TANGMING ROAD, GUANGMING NEW DISTRICT, |
| SHENZHEN, GUANGDONG,, CHINA 518132 |
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| ANDREW C. CHENG |
| 22928 ESTORIL DRIVE, UNIT 5 |
| DIAMOND BAR,, CA 91765 |
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