Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/07/2020
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Application #:
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15826054
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Filing Dt:
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11/29/2017
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Publication #:
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Pub Dt:
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05/30/2019
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Inventors:
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Rahul Agarwal, Milind S. Bhagavat
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Title:
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3D STACKED DIES WITH DISPARATE INTERCONNECT FOOTPRINTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE AMD PLACE, PO BOX 3453 |
KEVIN A. O'NEIL |
SUNNYVALE, CALIFORNIA 94088-3453 |
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TIMOTHY M. HONEYCUTT |
37713 PARKWAY OAKS LN. |
MAGNOLIA, TX 77355 |
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05/17/2024 02:49 PM
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