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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10534272
Issue Dt:
01/14/2020
Application #:
16127017
Filing Dt:
09/10/2018
Publication #:
20190004436
Pub Dt:
01/03/2019
Inventors:
Hsueh-Yi CHUNG, Yung-Cheng CHEN, Fei-Gwo TSAI, Chi-Hung LIAO, Shih-Chi FU, Wei-Ti HSU et al
Title:
METHOD OF FABRICATING RETICLE
Assignment: 1
Reel/Frame:
046841/0182Recorded: 09/11/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHUNG, HSUEH-YI
Exec Dt:
08/14/2015
CHEN, YUNG-CHENG
Exec Dt:
09/04/2015
TSAI, FEI-GWO
Exec Dt:
08/14/2015
LIAO, CHI-HUNG
Exec Dt:
08/26/2015
FU, SHIH-CHI
Exec Dt:
09/09/2015
HSU, WEI-TI
Exec Dt:
08/28/2015
CHUANG, JUI-PING
Exec Dt:
08/28/2015
CHANG, TZONG-SHENG
Exec Dt:
09/10/2015
CHEN, KUEI-SHUN
Exec Dt:
09/07/2015
CHEN, MENG-WEI
Exec Dt:
09/09/2015
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DR. SUITE 300
PARK CITY, UT 84098

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