Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/14/2020
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Application #:
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15918673
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Filing Dt:
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03/12/2018
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Publication #:
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Pub Dt:
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09/12/2019
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Inventors:
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James S. PAPANU, Wei-Sheng LEI, Jungrae PARK, Ajay KUMAR
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Title:
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HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW FIFTH AVENUE |
| SUITE 1900 |
| PORTLAND, OR 97204 |
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